The Taiwan government announced a major initiative to expand semiconductor research infrastructure and develop homegrown chip-design software through 2033. The Executive Yuan plans to invest NT$300 billion (US$9.51 billion) in next-generation chip design, advanced processes, and talent cultivation to maintain the nation's technological edge. Two key projects under the Taiwan Chip-based Industrial Innovation Program will run from 2024 to 2028. These include subsidizing seven university semiconductor institutes for equipment linked via a single service platform and establishing an atomic-scale process verification line for sub-1-nanometer processes at National Institutes of Applied Research. Taiwan Semiconductor Manufacturing Co (TSMC) is highlighted as having already begun high-volume production using its 2-nanometer process in the fourth quarter of last year, marking the most advanced semiconductor process currently in mass production. The government aims to leverage this ecosystem while developing independent electronic design automation (EDA) tools. Under the software initiative, universities will develop key EDA tools for advanced packaging, while the Industrial Technology Research Institute (ITRI) will build an intelligent EDA cloud platform. This effort seeks to integrate industry and research tools into a complete chip-design toolchain, addressing areas where international dominance is currently strong but emerging opportunities exist. The broader plan also includes support for SMEs to adopt digital technologies and AI, aiming to help at least 1 million small businesses integrate these advancements. While the article discusses defense spending and F-16 jet deliveries, the core financial and strategic focus remains on TSMC's role within the expanding national semiconductor ecosystem.