Ciena reported a blockbuster fiscal second quarter with revenues surging 39.5% year-on-year to $1.57 billion, driven by ongoing investments in AI-related network infrastructure and capacity. Earnings before interest, taxes, depreciation, and amortisation (EBITDA) grew dramatically by 324.4% to $283.1 million, while gross margins expanded to 44% from 40.2% a year earlier. Operating margins leaped significantly to 15.1% from 2.9%, reflecting the strength of Ciena's portfolio and disciplined execution in a dynamic supply environment. CEO Gary Smith, who has held the role for 25 years, stated that the results align with their long-term strategy to be the global leader in high-speed connectivity across WAN and datacentre environments, capitalizing on structural opportunities created by AI-driven demand. Despite beating sales and margin expectations and raising its annual revenue forecast to around $6.3 billion, Ciena's share price slumped 18.3% in early trading to $507.25 as shareholders had hoped for even better numbers, though the stock has risen more than 645% over the past year. SK Telecom joined Anthropic's Project Glasswing, an initiative expanded to 150 companies earlier in the week to test security implications of using its frontier large language model, Claude Mythos. SK Telecom was granted access to Claude Mythos Preview and intends to strengthen the security of its core infrastructure and services by proactively identifying and mitigating risk factors as it operates telecommunications and AI infrastructure for tens of millions of Koreans. This follows Verizon becoming the first telco to join Project Glasswing in mid-May, with both companies conducting testing activities in strict accordance with established protocols and governance guidelines to ensure emerging technologies are deployed safely and responsibly. Foxconn formed a strategic partnership with Intel to jointly accelerate the development and deployment of next-generation AI infrastructure and intelligent computing platforms. By combining Intel's strengths in processor architecture and silicon technologies with Foxconn's global manufacturing scale and system integration expertise, the two companies will explore comprehensive AI solutions spanning silicon, rack, system, and application layers. The collaboration aims to accelerate large-scale deployment of AI-driven technologies across edge and physical AI applications, leveraging Foxconn's '3+3+3' strategy to advance key technologies including AI, semiconductors, and next-generation communications while driving development of smart manufacturing, smart EV, and smart city platforms. Foxconn also announced a collaboration with SK Group's parent company on the development of AI servers, AI datacentres, and energy solutions. Leveraging Foxconn's strengths in AI server vertical integration, rack-scale system integration, advanced thermal technologies, and AI datacentre solutions, the partnership aims to advance next-generation AI infrastructure. SK Group is accelerating development of core technologies essential for the AI era, including industry-leading technological capabilities in next-generation AI memory technologies through SK Hynix. The two companies discussed opportunities in robotics, energy management, and battery technologies, with both parties looking forward to exploring future collaboration opportunities and creating new value in the AI era by combining SK Group's expertise in energy and critical technologies with Foxconn's strengths in global manufacturing, system integration, and AI application deployment.